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Gold Alloy Solder Preforms

Photonics.com
Mar 2018
Indium Corp.Request Info
 
CLINTON, N.Y., March 26, 2018 — Gold Alloy Solder PreformsPrecision gold alloy (AuSn) solder preforms from Indium Corp. are designed specially to meet the challenges facing radio frequency and power semiconductor devices as they continue to get smaller with increasing power density and power ratings.

Depending on the alloy, gold-based solders have a melting point ranging from 280 to 1064 °C, making it compatible with subsequent reflow processes. In addition, gold-based solders are resistant to corrosion, providing high thermal fatigue resistance and joint strength. The AuSn preforms have the highest tensile strength of any solder, ensuring high reliability for joining and sealing.

Applications include use in high-reliability fields such as aerospace, defense and medicine.


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