HD Thick-Film Etchable Gold Process

Remtec Inc.Request Info
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NORWOOD, Mass., April 19, 2018 — High-Definition Thick-Film Etchable Gold ProcessA high-definition etchable thick-film (HDTF) gold process on ceramic has been announced by Remtec Inc., offering advancement in miniaturization, circuit density, and performance.

Remtec’s etchable gold substrates allow the use of ultrafine lines with a standard line/spacing resolution of 50/50 µm and premium circuit of 25/25 µm. Circuit designers can also benefit from Remtec’s capability for added value features available on the same substrate. In addition to an etchable gold circuit, Remtec’s HDTF can incorporate conductor multilayers. It also integrates built-in components such as Lang couplers, inductors, filters, and high-precision resistors in a wide range from 50 mΩ to 1 MΩ laser trimmed to ±1 percent on the same ceramic base.

Typical applications for etchable gold HDTF ceramic metallization include use in products requiring high-circuit density and conductor proximity. HDTF substrates used for high-performance products such as mm-wave microwave circuits and high-pin-count analog and digital designs are ideal for radar, missile, and satellite communications systems in both defense and industrial applications.

Published: April 2018
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