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Hermetic SMT Packages

Remtec Inc.Request Info
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NORWOOD, Mass., Oct. 26, 2009 – Remtec Inc. has developed custom built power DC and radio frequency hermetic SMT packages for applications in the aerospace, military and high-end industrial markets. The flexibility of plated copper on thick film (PCTF) design and manufacturing allows easy integration of customer-specific packages into new designs and existing systems.

Remtec_SMT-packages.jpgThe technology permits circuit designers to achieve high power dissipation levels to 100 W, high current capacity of 75 A and high integration levels in lightweight, compact, low profile packages that are fully hermetic (10-8) per Military Standard 883C. Because each one is configured for a specific application, circuit designers can select those features that are best suited to their requirements. Among those are multichip modules, ball grid array construction, SMT leadless and leaded input/output connections, and high-voltage insulation. PCTF ceramic SMT packages can serve as a viable alternative to co-fired ceramic ones as well as metal-based glass-to-metal hermetic enclosures.

Military applications often require fully hermetic ceramic packages with built-in multilayer circuitry, low-DC-resistance copper tracks, low thermal resistance of below 1 °C/W, integrated passives and thermal hermetic vias. To meet these requirements, the company uses PCTF technology to design and fabricate a lightweight, low profile assembly measuring 33.8 × 23.6 × 2.5 mm. Its hermetic integral substrate package is thermally efficient and provides a high level of integration.

In some aerospace applications, designers use the high current carrying capacity of PCTF plated copper tracks and hermetic vias with low DC resistance of 0.5 m? and less. These design characteristics allow currents in excess of 15 to 25 A in the tracks as well as directly from a flip chip to input/output connections. This construction results in an SMD 0.5 fully compatible product in a standard size of 10.2 × 7.5 × 2.8 mm.

Industrial applications such as high-speed optical networks frequently necessitate hermetic leadless packages that must dissipate more than 5 W of power and operate at 10 GHz. To meet these specifications, the company offers a 16-mm package with a high integration level containing a multichip module with integrated resistors, transmission lines and low inductance leadless SMT connections in a housing that measures 16.0 × 16.0 × 2.8 mm.

For more information, visit:  

Remtec Inc.
100 Morse Street
Norwood, MA 02062
Phone: (781) 762-9191
Fax: (781) 762-9777
Oct 2009

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aerospaceball grid array constructionCompactDCdefensehermetichigh-voltage insulationindustrialLightweightmilitarymultichip modulesphotonicsphotonics.complated copper on thick filmProductsRemtecRFSMT leadless and leaded input/output connectionsSMT packages

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