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Hamamatsu Corp. - Photonics West 2026 LB

Imaging Development Kit

Teledyne FLIRRequest Info
 
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Imaging Development Kit. Courtesy of Teledyne FLIR OEM.The Boson+ IQ Development Kit from Teledyne FLIR OEM assists designers in developing edge AI capabilities using advanced thermal sensing across defense, security, and industrial platforms. It contains the Teledyne FLIR OEM AVP, which is powered by the Qualcomm Dragonwing QCS8550 system-on-chip. This produces 50 trillion operations/s with a typical power draw of just 2.5 W. The development kit supports Prism AI object detection models and Prism ISP features, including denoising and super resolution. The kit includes interface and carrier boards with three MIPI interfaces, which enable integration of visible or other sensor types into their systems. It also comes with Boson+ and Prism SDKs, hardware interface control documentation, and engineering support. The Boson+ IQ Development Kit is compatible with upcoming additions, including Prism SKR and Prism Supervisor. Prism SKR is for autonomous target detection and terminal guidance, and Prism Supervisor is for autonomous operation to designate way points via GPS or visual-based navigation location technology. Both software are for applications in defense, security, and industrial automation.


Published: September 2025




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