In-Line Subsurface Metrology System

Nearfield Instruments BVRequest Info
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ROTTERDAM, Netherlands, July 21, 2023 — The AUDIRA nondestructive, in-line subsurface metrology system from Nearfield Instruments BV enables accurate and reproducible nm-level measurements of buried features and defects in advanced memory and logic devices.

The system utilizes an acoustic microscopy technique combined with proprietary atomic force microscopy technology to gather measurement data from within the wafer without removing it from the manufacturing line. It complements existing metrology techniques such as transmission electron microscopy and critical dimension-scanning electron microscopy. It provides insights into the wafer's innermost layers and offers a fast, precise, and nondestructive approach to subsurface process control measurements.

Published: July 2023
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ProductsAUDIRAIn-Line Subsurface Metrology SystemTest & MeasurementNearfield InstrumentsMicroscopyEurope

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