Inspection System
Onto InnovationRequest Info
WILMINGTON, Mass., Oct. 9, 2017 — 
Truebump Technology in the Dragonfly Inspection System from Rudolph Technologies Inc. provides fast, accurate and repeatable 3D metrology for all advanced packaging bumping applications, from copper pillar to microbumps, and even large C4 bumps.
Truebump Technology is 3× faster and 25 percent more repeatable than Rudolph’s previous generation tool. The Dragonfly system’s high-volume throughput, combined with accuracy and repeatability, enable further adoption of stacked devices in advanced packaging applications that fuel today’s drive for thinner and lighter products that deliver more capability in a smaller form factor.
The Dragonfly system is designed for high-volume 2D inspection and 3D bump metrology on a single platform for the advanced packaging industry.
https://www.ontoinnovation.com
/Buyers_Guide/Onto_Innovation/c17840
Published: October 2017
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