Inspection and Metrology Platform

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WILMINGTON, Mass., Oct. 1, 2018 — Inspection and Metrology PlatformThe Dragonfly G2 inspection and metrology platform from Rudolph Technologies Inc. increases options for advanced-packaging customers to meet their wafer-based application challenges on a single platform.

The system incorporates the benefits of the company’s Firefly system onto the Dragonfly platform, including higher sensitivity and throughput, along with proprietary Clearfind Technology. To date, customer evaluations have reported throughput increases greater than 50 percent over the first-generation Dragonfly system. The Dragonfly G2 system achieves significant throughput and productivity increases using proprietary camera technology combined with stage speed and accuracy. Additionally, its modular architecture permits plug-and-play configurability of Rudolph’s technologies such as Truebump Technology for more accurate bump height measurement, and Clearfind Technology for nonvisual residue detection.

Streamlined software algorithms contribute to the faster throughput and enable the system to handle increasing bump counts, which have already exceeded 80 million bumps per wafer.

Published: October 2018
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ProductsInspection and Metrology PlatformDragonfly G2packagingWafersTest & MeasurementmetrologyAmericas

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