Inspection and Metrology Platform
Onto InnovationRequest Info
WILMINGTON, Mass., Oct. 1, 2018 — 
The Dragonfly G2 inspection and metrology platform from Rudolph Technologies Inc. increases options for advanced-packaging customers to meet their wafer-based application challenges on a single platform.
The system incorporates the benefits of the company’s Firefly system onto the Dragonfly platform, including higher sensitivity and throughput, along with proprietary Clearfind Technology. To date, customer evaluations have reported throughput increases greater than 50 percent over the first-generation Dragonfly system. The Dragonfly G2 system achieves significant throughput and productivity increases using proprietary camera technology combined with stage speed and accuracy. Additionally, its modular architecture permits plug-and-play configurability of Rudolph’s technologies such as Truebump Technology for more accurate bump height measurement, and Clearfind Technology for nonvisual residue detection.
Streamlined software algorithms contribute to the faster throughput and enable the system to handle increasing bump counts, which have already exceeded 80 million bumps per wafer.
https://www.ontoinnovation.com
/Buyers_Guide/Onto_Innovation/c17840
Published: October 2018
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to Onto Innovation by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required