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Integrated Circuit Multiproject Wafer Process

Photonics.com
Sep 2018
CEA-LetiRequest Info
 
GRENOBLE, France, Sept. 3, 2018 — Integrated Circuit Multi-Project Wafer ProcessLeti has announced a multiproject-wafer (MPW) process for the integrated-circuit industry, fabricating emerging nonvolatile memory OxRAM (oxide-based resistive RAM) devices on a 200-mm foundry base-wafer platform.

Available on Leti’s 200mm CMOS line, the MPW service provides a comprehensive, low-cost way to explore techniques designed to achieve miniaturized, high-density components. Including Leti’s Memory Advanced Demonstrator (MAD) future mask set with disruptive OxRAM technology, Leti’s integrated silicon memory platform is developed for backend memories and nonvolatility associated with embedded designs. The new technology platform will be based on titanium-doped hafnium oxide active layers.

Emerging OxRAM nonvolatile memory can be implemented in classical embedded memory applications on advanced nodes like microcontrollers or secure products, as well as for artificial intelligence accelerators and neuromorphic computing.


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