Integrated Circuit Package Inspection System
TeraView Ltd.Request Info
The EOTPR 4500 Integrated Circuit Package Inspection System from TeraView Ltd. features an auto prober designed for advanced technology and the accommodation of substrate sizes up to 150 mm × 150 mm.
With a probe tip placement accuracy to +/- 0.5 µm, the system allows users to probe large chip-let devices with a landing contact size of <5 µm such as copper pillars and TSV tips. It can isolate faults and simulate working conditions up to 250 °C.
https://www.teraview.com
/Buyers_Guide/TeraView_Ltd/c17011
Published: June 2022
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