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Integrated Circuit Package Inspection System

TeraView Ltd.Request Info
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CAMBRIDGE, England, June 22, 2022 — The EOTPR 4500 Integrated Circuit Package Inspection System from TeraView Ltd. features an auto prober designed for advanced technology and the accommodation of substrate sizes up to 150 mm × 150 mm.

With a probe tip placement accuracy to +/- 0.5 µm, the system allows users to probe large chip-let devices with a landing contact size of <5 µm such as copper pillars and TSV tips. It can isolate faults and simulate working conditions up to 250 °C.
Jun 2022
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ProductsEOTPR 4500integrated circuit package inspection systemTeraViewsemiconductorsR&DoptoelectronicsEurope

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