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JenLas D2.fs Femtosecond Laser

Jenoptik Laser GmbH, Healthcare & Industry
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JENA, Germany, July 5, 2011 — Jenoptik Laser GmbH’s Lasers & Material Processing Div. has released the JenLas D2.fs femtosecond laser based on diode-pumped disk laser technology.

The device provides good parameter stability suitable for use in industrial environments. The working temperature range is from 15 to 35 °C. It emits high pulse energies of 40 µJ, maximum, at a 100-kHz repetition rate and operates in the 30- to 200-kHz range. The beam quality of M2 = 1.25 is near the theoretical limit, and pulse duration is 400 fs.

It has been subjected to strict tests to guarantee safe functioning under typical transportation, storage and operating conditions. These include climate and shock tests, immunity to external electrical noise and compliance with the low electromagnetic compatibility standards for electrical noise emission.

The turnkey laser is easily integrated into complex machines and plants. The actuation signal can be released by software or hardware. The ultrashort femtosecond laser pulses are suitable for all materials processing applications that require minimal heat effects.

The laser can be used for processing inside of transparent materials such as glass, plastics and function layers and in the selective ablation of individual layers in multiple-layer systems consisting of different materials.

Industry applications in these areas include 3-D micromaterials ablation of metal or polymers, cutting of stents, thin-layer ablation in the semiconductor industry and removal of dielectric layers on crystal solar cells in photovoltaics. Other uses include scribing of sapphire substrates, processing of dental ceramics and internal marking of glass.
Jul 2011
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3-D micromaterials ablationBasic Sciencedental ceramicsdiode pumpeddisk laserenergyEuropefemtosecond laserGermanyglassglass markingindustrialJenLas D2.fsJenoptikLasers & Material Processing Div.low electromagnetic compatibilitymaterials processingmetalminimal heat effectsphotovoltaicsplasticspolymersProductsscribing sapphire substratesstent cuttingthin-layer ablationtransparent materialsturnkeylasers

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