LASER DIODE BONDER
Semiconductor Equipment Corp.Request Info
The model 860 Omni laser diode bonder is suitable for use with vertical-cavity surface-emitting lasers, edge-emitting laser diodes and laser bars and arrays. Semiconductor Equipment Corp. says it aligns and attaches die at a throughput rate of 140 per hour with an accuracy of ±5 µm. The platform has an extend-retract cube beamsplitter viewing system with illuminators, a stereozoom microscope on a pivoting mount and servomotor-driven Z motion with closed-loop temperature control.
http://www.semicorp.com
/Buyers_Guide/Semiconductor_Equipment_Corp/c13372
Published: February 2001
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to Semiconductor Equipment Corp. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required