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LED Die

Photonics.com
Nov 2014Plessey Semiconductors Ltd.Request Info
 
PLYMOUTH, England, Nov. 21, 2014 — Plessey LED diePlessey’s new large-area LED die is packaged with Litecool’s MicroSpot heat module for higher efficiency.

The die is based on its Plessey’s GaN-on-Si MaGIC LED technology. Its 4.5-mm, single source LED emitter, coupled with Litecool’s 10-W MicroSpot package with a thermal resistance of 0.7 C/W, produces a beam angle of 18° and a luminance size of 42 mm.

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