LED Die
Plessey Semiconductors Ltd.Request Info
PLYMOUTH, England, Nov. 21, 2014 — 
Plessey’s new large-area LED die is packaged with Litecool’s MicroSpot heat module for higher efficiency.
The die is based on its Plessey’s GaN-on-Si MaGIC LED technology. Its 4.5-mm, single source LED emitter, coupled with Litecool’s 10-W MicroSpot package with a thermal resistance of 0.7 C/W, produces a beam angle of 18° and a luminance size of 42 mm.
http://www.plesseysemiconductors.com
https://www.photonics.com/Buyers_Guide/Plessey_Semiconductors_Ltd/c24572
Photonics.com
Nov 2014
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