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LED and Electronic Cooling Material

Shin-Etsu Silicones of AmericaRequest Info
 
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AKRON, Ohio, Sept. 26, 2019 — LED and Electronic Cooling MaterialThe SDP Gap Filler Series of LED cooling materials from Shin-Etsu Silicones of America Inc. are ideal for cooling automotive electronics, power converters, LED lighting modules, communications modules, and other electronics.

Before curing, the material has a grease-like consistency that easily fills voids in any shape between heat sources and heat sinks. By displacing the air from these areas, a lower thermal resistance is achieved. Notably, the Gap Filler material can be applied only where users need it, thereby minimizing waste. The SDP series ranges in thermal conductivity from 1 to 9.5 W/mK.

In addition to sensors, notable automotive market applications include hybrids, engine control units, and heat dissipation of electric batteries. Each product comes as separate A and B components that must be mixed together in a 1:1 ratio to initiate the curing reaction.


Photonics.com
Sep 2019
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