LED and Electronic Cooling Material
Shin-Etsu Silicones of AmericaRequest Info
AKRON, Ohio, Sept. 26, 2019 —
The SDP Gap Filler Series of LED cooling materials from Shin-Etsu Silicones of America Inc. are ideal for cooling automotive electronics, power converters, LED lighting modules, communications modules, and other electronics.
Before curing, the material has a grease-like consistency that easily fills voids in any shape between heat sources and heat sinks. By displacing the air from these areas, a lower thermal resistance is achieved. Notably, the Gap Filler material can be applied only where users need it, thereby minimizing waste. The SDP series ranges in thermal conductivity from 1 to 9.5 W/mK.
In addition to sensors, notable automotive market applications include hybrids, engine control units, and heat dissipation of electric batteries. Each product comes as separate A and B components that must be mixed together in a 1:1 ratio to initiate the curing reaction.
https://www.shinetsusilicones.com
https://www.photonics.com/Buyers_Guide/Shin-Etsu_Silicones_of_America/c18594
Photonics.com
Sep 2019