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Laser Chip

HieFo Corp.Request Info

ALHAMBRA, Calif., Aug. 7, 2025 — The HOT25 specialty distributed feedback (DFB) laser chip from HieFo Corporation is designed for optical time domain reflectometer applications in fiber optic test and measurement equipment. The chip has an output power of 300 mW at 1310 nm and is adjusted for use at 25 °C. It has a 1-mm cavity length and uses HieFo’s proprietary low-noise laser architecture. HOT25 features a low relativity intensity noise of -145 dB/Hz½. HOT25 is a true DFB laser that operates at a single wavelength with a narrow linewidth that supports frequency-modulated continuous-wave coherent detection.

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Published: August 2025

There are 437 suppliers of Lasers in the Photonics Marketplace.

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