Laser Dicing and Grooving Platform
ASMPT NEXX Inc.Request Info
ALSI LASER1206 from ASMPT Semiconductor Solutions is a system for bare wafer handling and separation under Class 1000 cleanroom conditions. LASER1206 features patented multibeam laser processing technology, with fully automated film frame and bare wafer handling. The patented UV laser technology achieves maximum precision with minimal heat impact, which reduces burr formation and die strength degradation. The device has an integrated wafer coating and cleaning station and offers numerous options for fully automated handling of film frames and bare wafers. The positioning accuracy of the planar motion system is <1.5 μm. For grooving, wafers from 60 to 800 μm can be processed, while for dicing, the wafer thickness ranges from 20 to 200 μm.
https://semi.asmpt.com
/Buyers-Guide/ASMPT-NEXX-Inc/c34662
Published: September 2025
From the Photonics Marketplace
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to ASMPT NEXX Inc. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required