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Laser-Processing Systems

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Two new laser systems have been announced by LPKF Laser & Electronics.

The Fusion 3D 1200 Laser Direct Structuring System features a rotary indexing table and a vision system. Small-, medium- and large-scale production of molded interconnect devices (MIDs) is possible. Conductor structures are applied to 3-D plastic parts. Metal tracks are then formed on the structures through an electroless plating process.

The MicroLine 2820P Laser Depaneling System cuts printed circuit board (PCB) panels and cover layers. Lead times are reduced while tooling costs of layout changes are eliminated. Substrates are held securely on a vacuum table, suitable for depaneling, cutting and engraving a variety of materials.



Published: January 2015
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