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Laser Ablation Processing

TESCANRequest Info
 
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BRNO, Czech Republic, Nov. 3, 2021 — Laser Ablation ProcessingThe Large Volume Workflow from TESCAN Orsay Holding AS provides fast failure and defect root-cause analysis in semiconductor manufacturing and materials research.

The method implements correlative microscopy techniques to provide parallel processing through standalone laser ablation and plasma focused ion beam systems. The laser ablation system can prepare samples for multiple downstream tools, resulting in an increase in analytical throughput and productivity to reduce cost per analysis. Rapid cubic-millimeter-scale material removal is provided for sample preparation and analysis workflows, harnessing fast material removal rates, even for nonconductive hard materials like glass and ceramics.

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Nov 2021
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