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Laser Assembly Gain Chip

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ALHAMBRA, Calif., Sept. 16, 2024 — HieFo Laser Assembly Gain ChipThe HGC20 from HieFo is a high efficiency C+ band gain chip for building integrated tunable lasers. The chip is 1 mm in cavity length mounted on a proprietary submount and is capable of producing optical outpower approaching 22 dBm. For applications requiring lower overall module power consumption, the HGC20 improves wall plug efficiency by as much as 40%.



Published: September 2024
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ProductschipsGain ChipsTunable LasersLasersmaterials processingOpticsindustrialAmericasHieFo

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