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Laser Cutting SubSystem

Coherent Inc.Request Info
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SANTA CLARA, Calif., July 19, 2019 — The PowerLine AVIA NX from Coherent Inc. is a laser cutting subsystem that combines a high-power, UV laser with precision scan optics to deliver rapid throughput and high-cut quality.

The device processes wafers, systems-in-package, and printed circuit boards. A two-axis galvanometer deflector, beam expander, and f-theta scan lens produces small, focused spot sizes at the work surface with high positional accuracy and stability to create fine features and narrow cuts with a minimal heat affected zone.

The system is designed for easy integration by system builders.
Jul 2019

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ProductsLaser Cutting Sub-SystemPowerLine AVIA NXCoherentlaserswaferAmericasLaser Cutting Subsystem

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