Layer Release System

EV Group (EVG)Request Info
Facebook X LinkedIn Email
EV Group Layer Release SystemThe EVG®850 NanoCleave from EV Group is a system that enables nanometer-precision release of bonded, deposited, or grown layers from silicon carrier substrates. The system does this by utilizing an IR laser coupled with specially formulated inorganic release materials in a high-volume-manufacturing capable platform, eliminating the need for glass carriers. This in turn enables ultra-thin chiplet stacking for advanced packaging, as well as ultra-thin 3D layer stacking for front-end processing, including advanced logic, memory, and power device formation.

Published: January 2024
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:

When you click "Send Request", we will record and send your personal contact information to EV Group (EVG) by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.

Register or login to auto-populate this form:
Login Register
* Required

Productsmaterials processingWafersLasersinfrared lasersOpticsinfraredEuropeEV Group

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.