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Lidar Receiver Subsystem

Advanced Thermal Solutions Inc.Request Info
 
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NORWOOD, Mass., Nov. 4, 2021 — Lidar Receiver SubsystemfanSINKS heat sinks from Advanced Thermal Solutions Inc. are designed for component sizes ranging from 27 to 70 mm2.

The wider size range accommodates hot semiconductor components, including field-programmable gate arrays, application-specific integrated circuits, and other package types used in telecommunications, optics, test and measurement, military and other applications. The fanSINKS feature cross-cut, straight aluminum fins. They support omnidirectional airflow for optimum cooling performance from attached fans and ambient air.

The devices attach securely to components using the maxiGRIP high-reliability mechanical attachment system. For larger components, they mount tightly to printed circuit boards using PEM pushpins that secure into 3-mm through holes.



Published: November 2021
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