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Olympus Europa SE & Co. KGRequest Info
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Olympus.jpgOlympus Life Science Europa GmbH has unveiled an infrared confocal laser scanning microscope for nondestructive observation of the interior of silicon wafers, integrated circuit chips and microelectromechanical systems. The OLS3000IR LEXT uses a 1310-nm laser to see through the silicon to the components, enabling inspection, measurement and analysis of system in package, 3-D mounting and chip scale package. Applications include flip chip mounting defect analysis, chip damage analysis and chip gap measurement.

Photonics Spectra
Sep 2008

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