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Memory Modules

SMART Modular Technologies Inc.Request Info
 
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NEWARK, Calif., May 28, 2020 — Memory ModulesSMART Modular Technologies Inc. has expanded its line of Module-in-a-Package (MIP) solutions to increase memory in industrial Internet of Things and embedded computing applications.

The package expands on the currently offered MIP density range to 16 GB. The small form factor design is also targeted for use in broadcast video and mobile routers for the maximizing of DRAM capacity within space-constrained limitations. Operating up to DDR4-3200, the package is an ideal solution to replace multiple down-board DRAMs or SO-DIMMs. Compared to solder down approaches, main board routing complexity is reduced by avoiding the need for back-to-back chip placements.

The MIP contains all necessary passives and a thermal sensor, eliminating the need to place these components.


Photonics.com
May 2020
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ProductsSmart Modular Technologiesmemory modulesModule-in-a-PackageMIPindustrialInternet of ThingsdatacomputingCommunicationsaerospacenetworksAmericas

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