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Micro-Via Drilling System

ESI - Electro Scientific IndustriesRequest Info
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Micro-Via Drilling SystemThe Geode laser-based micro-via drilling system from Electro Scientific Industries Inc. is designed for high-density interconnects on rigid printed circuit boards.

The system combines a 9.4-µm pulsed CO2 laser and advanced beam control capabilities to deliver high throughput and accuracy from a system that is significantly smaller and lighter than current competitive offerings. Sophisticated beam steering and pulse shaping technologies provide the flexibility and control required for 5G applications using high-frequency compatible materials and finer-pitched interconnects fabricated with modified semi-additive processes.

Its HyperSonix technology shapes laser pulses to improve throughput and via quality. AcceleDrill distributes pulse energy to improve throughput and via metrics and also permits multiple via sizes in a single pass. Via density compensation controls local heating to minimize heat-affected zones and improve accuracy, throughput, and diameter stability.

Photonics Spectra
May 2019
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ProductsGeodemicro-via drilling systemLasersOpticsMaterialsAmericasElectro Scientific Industries

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