Multi-Axis Systems for Laser Materials Processing

BUSCH Microsystems GmbH

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Multi-Axis Systems for Laser Materials Processing

Busch Microsystems designs and manufactures positioning systems that provide solutions to the diverse needs of semiconductor manufacturing and laser materials processing applications. If you are looking for higher stiffness, dynamics, and accuracy for your application, then Busch Microsystems has what you need. Busch can integrate their precision positioning systems with controllers, software, and beam delivery components to provide turnkey solutions with the following requirements:

Resolution up to 1 nm

Absolute accuracy <1 µm

Repeatability up to 0.05 µm

High-resolution Z-axis with linear motor

Air Bearing Stages

Selection of clean room materials

Busch positioning systems and turnkey solutions are utilized in several emerging semiconductor and laser markets and applications such as:

Display manufacturing

Glass cutting

Medical stent manufacturing

Laser welding

Flat panel processing

Pick n Place

PCB processing

Wafer handling and Bonding

A complete system is only as good as the selection and optimization of the required individual components. Our longstanding experience and excellent cooperation with leading component manufacturers for all assemblies enable the fast implementation of an application in its optimum design. From engineering up to the manufacture and installation of your system solution – Busch ensures the maximum system accuracy and reproducibility. As a result, the only standard is PRECISION.

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