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MultiBeam SEM-FIB System

JEOL USA Inc.Request Info
 
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For Micromilling and High-Res SEM Imaging
PEABODY, Mass. Nov. 29, 2007 -- JEOL USA Inc. said its new high-throughput JIB-4500 MultiBeam SEM-FIB (scanning electron microscope, focused ion beam) combines the high-resolution imaging of the JEOL LaB6 electron column with real-time micromilling and monitoring capability.

The MultiBeam is a high-productivity tool for integrated circuit defect analysis, circuit modification, TEM (transmission electron microscope) thin-film sample preparation, and mask repair.

JEOLMultiBeam.jpgA versatile all-in-one system, the MultiBeam features serial slicing and sampling (S3) for in-process monitoring of milling, fabrication, and reconstructing 3-D images of the sectioned area. A maximum milling current of 30 nA ensures high throughput milling of large areas.

Additional features include low vacuum operation for nonconductive specimens without coating or alteration, a gas injection system for etching and deposition, a large stage for up to 150-mm samples, and a multiple port design for a range of analytical needs. Samples are loaded through a standard airlock system.

JEOL USA said it has formed partnerships with the University of Southern California and Boston College and that MultiBeam systems will be delivered to each school's new nanoimaging lab in early 2008.

For more information, visit: www.jeolusa.com; e-mail: [email protected]

JEOL USA Inc.
11 Dearborn Rd.
Peabody, MA 01960
Phone: (978) 535-5900
Fax: (978) 536-2205



Published: November 2007
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analysisdefectdepositionetchingImagingintegrated circuitsJEOL LaB6JEOL USAJIB-4500micromillingMicroscopyMultiBeamnanonanoimagingphotonicsProductsSEM-FIBTEMtransmission electron microscope

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