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NSC1101 Readout Circuit

Photonics.com
Oct 2011New Imaging Technologies (NIT)Request Info
 
VERRIÈRES LE BUISSON, France, Oct. 14, 2011 — The NSC1101 from New Imaging Technologies is a high-dynamic-range readout circuit that interfaces with any photodiode array through flip chip bonding. In VGA format, it has 640 × 512 pixels with a 15-μm pitch. It can accept any photodiode array with p-on-n or n-on-p.

Because of its Native Wide Dynamic Range of more than 120 dB, the sensor does not require any setting or exposure time control.

It can be used with all infrared sensing materials, including InSb, InGaAs and HgCdTe, and can operate at a cryogenic temperature of 80 K. Another photosensing material that can be used is AsGa for terahertz and x-ray detection.

The sampling stage can be ordered in an 8-in.-wafer form.

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