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Fast-Cure, Low-Shrink Adhesive
TORRINGTON, Conn., Aug. 14, 2009 – Dymax Corp.’s OP-67-LS optical-mechanical adhesive cures in seconds to bond optical components. Its low-shrink nature virtually eliminates movement during curing and subsequent thermal cycling, and it provides users with the ability to cure on demand upon exposure to long-wave UV and visible light, allowing maximum flexibility in positioning parts prior to cure.

Dymax-Adhesive.jpgThe adhesive offers good moisture resistance, low outgassing and adhesion to a variety of substrates including metal, glass, ceramic and polycarbonate, enabling its use in many critical and demanding applications. The material also exhibits a high depth of cure. Applications include fiber optic V-groove bonding, laser diode positioning, fiber pigtailing, transceiver potting, vertical-cavity surface-emitting laser positioning, and mounting active devices or passive couplers, prisms and other optical device assemblies.

The precision bonding adhesive has a one-year shelf life when stored at room temperature. Pot life is unlimited when kept in the dark. There is no waste or scrap as there is with two-part materials.

The company also manufactures a complete line of UV/visible light-curing systems that are matched to the curing chemistry of OP-67-LS for fast, automated manufacturing and lower processing costs. High-intensity spotlamps provide fast cures for small drops of adhesive, while stationary floodlamps and lamps mounted over conveyors provide curing of assembly resins in large-area applications.

For more information, visit:  

Dymax Corp.
318 Industrial Lane
Torrington, CT 06790
Phone: (860) 482-1010
Fax: (860) 496-0608
Aug 2009

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adhesiveBasic ScienceDymaxfast-curefiber optic V-groove bondingfiber pigtailinghigh depth of cureindustriallaser diode positioninglow outgassinglow-shrinkmoisture-resistantOP-67-LSoptical-mechanicalphotonicsphotonics.compolycarbonateProductstransceiver pottingVCSEL positioning

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