Photoelectric Sensor
SICK Inc.Request Info
MINNEAPOLIS, Jan. 31, 2011 — Sick Inc. has launched its high-performance W9-3 photoelectric sensor in a robust plastic housing. The third-generation device offers a wide variety of options to choose from, such as sensing range, mounting and connectivity, making it suitable for applications including detecting clear materials and multicolored and shiny objects in the materials handling and food and beverage industries.
A proprietary plastic and molding process makes the sensor rugged. The material, called Vistal, is nine times stronger than standard acrylonitrile butadiene styrene, according to the company. The connector is overmolded onto the device, creating a sensor that is nearly unbreakable.
A proprietary third-generation custom application-specific integrated circuit incorporates OES3 technology to provide additional advantages, such as good background suppression at an extended range. The OES3 contains proprietary technology that enables the W9-3 to ignore stray background reflections, detect multicolored/shiny objects and provide high immunity to ambient light.
The sensor has many mounting options due to its slotted through-hole design. This feature offers the ability to mount the sensor from 5.2 to 13.7 mm and from 18.9 to 27.4 mm, ensuring that it can be mounted in any number of configurations.
It has complementary (light and dark operate) outputs in one housing to help reduce the inventory of different parts that customers typically have to have in stock to solve multiple types of applications. It offers many ways to easily adjust the sensing range. Because of OES3 technology, the sensor is electronically taught and contains no mechanical moving parts, enabling push-button teach-in that is as precise as a potentiometer adjustment.
http://www.sickusa.com
https://www.photonics.com/Buyers_Guide/SICK_Inc/c13548
Photonics.com
Jan 2011
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