Photonic Debonding Tool

PulseForge Inc.Request Info
Facebook X LinkedIn Email
The PD300 SA Photonic Debonding Tool from PulseForge Inc. is a semi-automated system suitable for wafer- and panel-level packaging, delivering a clean wafer separation solution.

Designed to enable semiconductor advanced packaging for R&D and low-volume users, the tool utilizes a photonic debonding process. It leverages high-intensity pulses of light in conjunction with reusable, light-absorbing layer carriers to debond temporarily bonded materials for wafer thinning, hybrid bonding, and micro-LED transfer. The tool can debond warped wafers without expensive warpage adjustment hardware or process changes.

Published: May 2023
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:

When you click "Send Request", we will record and send your personal contact information to PulseForge Inc. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.

Register or login to auto-populate this form:
Login Register
* Required

ProductsPD300 SAPhotonic Debonding ToolPulseForgeWafersR&DLight SourcesAmericas

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.