Photonic Microassembly System
FINETECH GmbH & Co. KGRequest Info
The FINEPLACER® femtoblu bonding system from Finetech GmbH & Co. KG is an automated microassembly cell for dedicated photonic production.
Demanding applications benefit from a placement accuracy of 2 µm at 3σ and an ultra-low force bonding capability down to 5 gram-force. Designed for prototyping and high-yield production duties, the system supports all bonding technologies specifically required for the assembly of photonic and optoelectronic components. A complete machine enclosure minimizes external influences to ensure a stable process environment and protects the operator against gas, vapor, and UV radiation. The DualCam visual alignment system with twin-camera module and beamsplitter provides application-specific fields of view, digital zoom, and various LED illumination options. It also delivers optics shifting along the X-axis for optimal viewing of a wide spectrum of component sizes.
Applications include communications, aerospace, automotive, medical technology, consumer electronics, semiconductor, military, universities, and R&D.
https://www.finetech.de
/Buyers_Guide/FINETECH_GmbH_Co_KG/c4948
Published: October 2020
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to FINETECH GmbH & Co. KG by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required