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Photonic Microassembly System

FINETECH GmbH & Co. KGRequest Info
 
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BERLIN, Oct. 20, 2020 — Photonic Microassembly SystemThe FINEPLACER® femtoblu bonding system from Finetech GmbH & Co. KG is an automated microassembly cell for dedicated photonic production.

Demanding applications benefit from a placement accuracy of 2 µm at 3σ and an ultra-low force bonding capability down to 5 gram-force. Designed for prototyping and high-yield production duties, the system supports all bonding technologies specifically required for the assembly of photonic and optoelectronic components. A complete machine enclosure minimizes external influences to ensure a stable process environment and protects the operator against gas, vapor, and UV radiation. The DualCam visual alignment system with twin-camera module and beamsplitter provides application-specific fields of view, digital zoom, and various LED illumination options. It also delivers optics shifting along the X-axis for optimal viewing of a wide spectrum of component sizes.

Applications include communications, aerospace, automotive, medical technology, consumer electronics, semiconductor, military, universities, and R&D.



Published: October 2020
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ProductsPhotonic Microassembly SystemfinetechOpticsCommunicationsaerospaceautomotiveBiophotonicslife sciencesmedicineConsumeroptoelectronicssemiconductorsdefenseR&DEurope

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