Request InfoCarl Zeiss X-ray Microscopy LLCPLEASANTON, Calif., Oct. 1, 2019 — The Xradia 620 Versa RepScan® 3D from Zeiss is a submicron-resolution, 3D, nondestructive imaging solution for inspection and measurement that accelerates time to market for advanced integrated circuit packages. The device provides rich volumetric and linear measurements of buried features in advanced packages that cannot be achieved with existing methods such as physical cross-section, 2D x-ray, and micro-CT. The result is higher-accuracy engineering data that can be used to reduce development and yield learning cycles of advanced packages. 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