Request InfoSCHOTT North America Inc.Designed for optoelectronics applications, the AF 32 glass introduced by Schott North America Inc. is suitable for use in the wafer-level chip scale packaging and optics markets. Its coefficient of thermal expansion matches that of silicon, helping to prevent warp during the manufacture of complex assemblies and during reflow, when a wafer-level chip scale packaging imager is attached to a printed circuit board. Thicknesses range from 0.1 to 1.1 mm, and the fire-polished surface of the glass achieves a roughness value below 1 nm rms, eliminating the need for fine mechanical polishing. AF 32...See full productRelated content from Photonics MediaWEBINARSPhotonics.com 7/20/2023Motorized and Calibrated Lenses for Machine Vision ApplicationsMany applications have benefited from motorized varifocal lenses that allow automatic or remote adjustment of focus distance and field of view. Applications may need to change the focal length or...Photonics.com 10/27/2021Fiber Optic Solutions for Medical DevicesSteve Allen provides a brief overview and examples of procedures that continue to push adoption and proliferation of optical fiber-based medical devices. From cosmetic surgery to cutting-edge sensing...Photonics.com 1/9/2023Innovations in Ultrashort-Pulse and RF-Excited CO2 Lasers Expand Materials Processing ApplicationsIndustrial laser materials processing is constantly evolving. Industries as varied as pharmaceutical, consumer electronics, automotive, aerospace, and textiles, among others, have benefited from new...Photonics.com 1/18/2018Fiberguide RARe Motheye Fiber: Random Anti-Reflective (RARe) Nanostructures on Optical Fibers as Replacement for AR CoatingsAnti-reflective (AR) coatings are now entering their second century and have remained virtually unchanged throughout their life. As power level and wavelength range requirements continue to increase,...