Request InfoFINETECH GmbH & Co. KGFinetech GmbH & Co. KG has expanded its Fineplacer product line with the introduction of the Fineplacer Femto, an automated submicron bonder for assembly of optoelectronic components. It can be used to assemble and bond laser bars and diodes, flip chips, VCSELs, MEMS, sensors, micro-optics, surface-mount photonics and simple die attach. The 1270 × 900-mm system exhibits accuracy of ±5 μm. Features include a large working area, and automatic pattern recognition and alignment based on motorized X, Y, Z and theta movements. Processes are automatically controlled and do not require...See full productRelated content from Photonics MediaPRODUCTSVision Spectra Winter 2022 IssueContact Image SensorsThe AxCIS™ Contact Image Sensors from Teledyne DALSA are high-speed, high-resolution, fully integrated line scan imaging modules for machine vision applications. 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