Request InfoMKS/NewportThe MRSI-5005 advanced packaging work cell is offered by Newport Corp. This packaging system combines GaAs die handling and flip-chip bonding for component attachment applications with MEMS and with RF, microwave and millimeter-wave modules. It also is suitable for thermal compression flip bonding. Features include placement accuracy of ±5 µm, 360° random die orientation, substrate alignment, programmable controlled force and automatic tip changing. The MRSI-5005 accepts parts in cassette-to-cassette handling mode, wafer pickup, waffle and gel packs, and tape feeders.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 3/7/2019In Vivo Medical Laser Procedures: An OverviewThis webinar, presented by OFS, will provide an overview of current in vivo medical procedures performed using lasers and optical fibers. The presentation will begin with a brief history of...Photonics.com 7/22/2021STANDARDS UPDATE: Vision Standards: An Overview of Global and A3 DevelopmentsStandards play a key role in the vision and imaging industry by ensuring interoperability of components, increasing market size, and shortening the time it takes to get new products to market. As the...Photonics.com 1/18/2018Fiberguide RARe Motheye Fiber: Random Anti-Reflective (RARe) Nanostructures on Optical Fibers as Replacement for AR CoatingsAnti-reflective (AR) coatings are now entering their second century and have remained virtually unchanged throughout their life. As power level and wavelength range requirements continue to increase,...Photonics.com 6/30/2021European Photonics Manufacturing Services Funded by ECThis event is supported by the European initiatives presented and is moderated by EPIC, the European Photonics Industry Consortium. The European Commission is helping companies access the...