Request InfoValley Design Corp., HeadquartersValley Design Corp. says it has improved its techniques for cutting, wafering and slicing glass and crystal, promising the least possible kerf loss when cutting. Instead of grinding thick blanks of material for thin wafers, the company provides savings by cutting the blanks into multiple wafers. The parts can be made as thin as 0.020 in. with a standard tolerance of 0.001 in. The as-cut finish ranges from 15 to 30 µin.See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra February 2024 IssueHyperspectral Illumination SystemThe Hyperspectral Illuminator from Lasersec Systems generates high powered broadband sources in the SWIR region of the spectrum to allow for active hyperspectral imaging while in use. 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In this presentation, we will explain the various processes...PHOTONICS BUYERS' GUIDE CATEGORIESMotion ControllersHeCd LasersEmbedded Vision SystemsFluorine LasersCOMPANIESPhotonics Buyers' GuideValley Design Corp., HeadquartersSince 1975 Valley Design Corp. has been an industry leader in advanced materials processing, as providers of precision lapping, polishing, dicing, 4- and 5-axis CNC machining, grinding, core drilling...Photonics Buyers' GuideLaCroix Precision OpticsThe LaCroix name is synonymous with quality precision optics. Since 1947, three generations of family leadership have guided LaCroix Precision Optics to become the premier precision optics...Photonics Buyers' GuideBaumer Ltd.Baumer Group is a manufacturer of sensors, encoders, measuring instruments, and components for automated image processing. Baumer combines innovative technologies and customer-oriented service into...Photonics Buyers' GuideTeledyne DALSA, Machine Vision OEM ComponentsTeledyne DALSA is a part of Teledyne’s Vision Solutions group and a leader in the design, manufacture, and deployment of digital imaging components for machine vision. Teledyne DALSA image...