Request InfoGT Advanced Technologies, Advanced Materials GroupCrystal Systems' fixed abrasive slicing technology uses a pack of wires with diamond particles to slice silicon, sapphire, silicon carbide and other materials that require precise fabrication. For example, this technique can be used to slice sapphire wafers for light-emitting diodes. The slicers can rotate workpieces at speeds of up to 5000 rpm. The company says this technology provides high wafer accuracy, low kerf loss, low damage, and cutting rates that are three times higher than those achieved by other methods.See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra January 2024 IssueArc Flash Safety Testing ToolsThe series of thermal imaging and wireless testing tools from Fluke include the PQ400, CV400 ClirVu, TiS75+, 376 FC, and 3000FC for arc flash safety. 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