Request InfoFlip Chip Opto Inc.Flip Chip Opto Inc. has announced the Apollo 1200 chip-on-board (COB) LED module. Based on 3-Pad LED flip chip and Pillar MCPCB (metal core printed circuit board) technologies, both junction temperature and thermal decay are minimized due to 0.006 °C/W thermal resistance, allowing more than 120,000 lumens to be emitted from a single module. The modules enable energy-efficient LED technology to replace metal halide lamps in high-power lighting applications such as high masts, stadiums, airports, shipping terminals, maritime settings and more. 3-Pad technology creates an extra...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra April 2024 IssueCollimating LensesThe CL12G and CL30G from LumeDEL LLC are collimating lenses optimized for fiber optic patch cords with high numerical aperture up to 0.63. 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