Request InfoAdvanced Semiconductor Engineering Inc. (ASE)SUNNYVALE, Calif., June 20, 2022 — The VIPack™ packaging platform from Advanced Semiconductor Engineering Inc. is designed to enable vertically integrated package solutions. The platform leverages advanced redistribution layer processes, embedded integration, and 2.5D and 3D technologies when integrating multiple chips within a single package. The six core packaging technology pillars include high-density, RDL-based Fanout Package-on Package (FOPoP); Fanout Chip-on-Substrate, (FOCoS); Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge); Fanout System-in-Package (FOSiP); and Through Silicon Via (TSV)-based 2.5D, 3D...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra June 2023 IssueFan-Out-Package-on-PackageThe Fan-Out-Package-on-Package (FOPoP) solution from Advanced Semiconductor Engineering Inc. is designed to lower latency and deliver bandwidth advantages for the dynamic mobile and networking...Photonics.com 12/23/2022FPGA PlatformThe Lattice Avant™ field-programmable gate array (FPGA) platform from Lattice Semiconductor Corp. offers high efficiency, advanced connectivity, and optimized computing power for the...Photonics.com 7/22/2022Digital Signal ProcessorsThe Tensilica ConnX 110 and ConnX 120 radar, lidar, and communications digital signal processors (DSPs) from Cadence Design Systems Inc. provide broad performance range from the low to the ultrahigh...Photonics.com 8/11/2022400G TransceiversFIBERSTAMP Technology Co. 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These...WEBINARSPhotonics.com 9/21/2023Precision Automation Principles for the Optimal Testing and Packaging of PIC DevicesProduction-scale testing of silicon photonic devices continues to be a challenge due to the multi-degree-of freedom, high-precision, optical alignments required for wafer- and die-level testing. Wide...Photonics.com 5/10/2022Expanding Implementation of Fast Optimization Technology for Photonics, Optics, and Quantum Manufacturing ApplicationsAlignment time is the largest contributor to the cost of silicon photonics and optical assemblies. New industrial automation technology dramatically shortens the time required to optimally align...Photonics.com 4/26/2022Achieving Ultralow-Loss Photonics Array AlignmentTwo- and three-dimensional photonics arrays are commonly used for coupling light in photonic integrated circuits (PICs). 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