Request InfoTeledyne Advanced Electronic SolutionsTeledyne Microelectronics develops advanced microelectronics packaging for high-speed broadband communications, including fiber optic transmitters, receivers, multichannel transceivers and optical assemblies. The company provides low-, medium-, or high-volume miniature optoelectronic packaging design, assembly and test. It specializes in packaging ultradense microminiature devices on a variety of substrates, including LTCC, HTCC and thick/thin film. 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