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Die Bonder

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MRSI Mycronic
TEWKSBURY, Mass., Aug. 3, 2022 — The MRSI-H-HPLD+ die bonder from MRSI Systems is tailored for high-power laser die attachment applications. Improving throughput by using parallel processing, the die bonder is a variant of the MRSI-H-HPLD model. It can be used in high-mix, high-volume flexible manufacturing, maintaining high accuracy and flexibility.See full product

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