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Epoxy Potting and Encapsulating Compound

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EpoxySet Inc.
LINCOLN, R.I., Aug. 24, 2017 — The EP-207 thermally conductive epoxy potting and encapsulating compound from EpoxySet Inc. is designed for electronics and heat dissipating devices. The room temperature curing system is UL-94V0 yellow-card-listed with excellent electrical insulating properties and high dielectric strength. It is low viscosity and creates strong seals to metals, ceramics, glass and many engineered plastics. Numerous packaging options are available including dual barrel cartridges, pints, quarts, gallons as well as premixed and frozen syringes. The EP-207 is ideal for thermal cycling applications...See full product

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