Request InfoSET Corp. SASAINT-JEOIRE, France, Feb. 25, 2020— ACCμRA flip-chip bonders from Smart Equipment Technology SA are dedicated to production for optoelectronic and silicon photonics applications. The ACCμRA Plus is designed for ± 0.5-μm post-bond accuracy in fully automatic mode and is suitable for reflow and thermocompression processes by combining high precision, flexibility, and short cycle time. The ACCμRA OPTO also allows ± 0.5-μm post-bond accuracy, but is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of the process. The ACCμRA OPTO combines high...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra May 2023 IssuePhotonic Device Design PlatformVersion 2.5 of the VPIdeviceDesigner software from VPIphotonics GmbH provides Python-driven design framework for photonic devices. 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