Request InfoShibuya Corp.The FDB210P Flip Chip Bonder from Shibuya Corp. can be used for the mass production of optical devices and semiconductors that require sub-μm level of bonding accuracy. The system is able to handle microchips of up to 0.15 sq. mm, achieving high-accuracy alignment within sub-μm post bonding. Its highly rigid frame is hardly affected by temperature fluctuation, and full-closed axes control enables accurate alignment. These features maintain high-accuracy bonding performance stability. The bonding process for multiple chips can be easily achieved by high-speed pulse heaters...See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 3/2/2023Wafer Vision Inspection HandlerThe Wi8i G2 PRO Wafer Vision Inspection Handler from ViTrox Technologies Sdn. 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