Request InfoO.C. White Co.The O.C. White Co. offers the benchtop 3-D BGA Inspection System with three-chip camera technology. Its lens design provides 50x to 200x magnification and its metal-halide light source includes four fiber optic light bundles with white light at 5500 K for daylight illumination without blind spots. The three-chip camera technology is designed for clear, sharp 3-D images displayed on a high-resolution 15-in. color monitor. The system is suitable for inspection of solder joints and paste prints, surface structure, placement alignment, presence of flux and microcracking.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 1/18/2018Fiberguide RARe Motheye Fiber: Random Anti-Reflective (RARe) Nanostructures on Optical Fibers as Replacement for AR CoatingsAnti-reflective (AR) coatings are now entering their second century and have remained virtually unchanged throughout their life. As power level and wavelength range requirements continue to increase,...Photonics.com 1/9/2023Innovations in Ultrashort-Pulse and RF-Excited CO2 Lasers Expand Materials Processing ApplicationsIndustrial laser materials processing is constantly evolving. Industries as varied as pharmaceutical, consumer electronics, automotive, aerospace, and textiles, among others, have benefited from new...Photonics.com 3/7/2019In Vivo Medical Laser Procedures: An OverviewThis webinar, presented by OFS, will provide an overview of current in vivo medical procedures performed using lasers and optical fibers. The presentation will begin with a brief history of...Photonics.com 1/12/2023A Proven, Portable, and PIC-Based Methodology for Cultivating a Next-Generation WorkforceWith the passage of the CHIPS and Science Act and growing demand for photonic integrated circuit technology, the semiconductor industry is once again gaining momentum. But even as the U.S. rebuilds...