Request InfoTeraView Ltd.CAMBRIDGE, England, June 22, 2022 — The EOTPR 4500 Integrated Circuit Package Inspection System from TeraView Ltd. features an auto prober designed for advanced technology and the accommodation of substrate sizes up to 150 mm × 150 mm. With a probe tip placement accuracy to +/- 0.5 µm, the system allows users to probe large chip-let devices with a landing contact size of <5 µm such as copper pillars and TSV tips. 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