Request InfoSemiconductor Equipment Corp.The model 860 Omni laser diode bonder is suitable for use with vertical-cavity surface-emitting lasers, edge-emitting laser diodes and laser bars and arrays. Semiconductor Equipment Corp. says it aligns and attaches die at a throughput rate of 140 per hour with an accuracy of ±5 µm. The platform has an extend-retract cube beamsplitter viewing system with illuminators, a stereozoom microscope on a pivoting mount and servomotor-driven Z motion with closed-loop temperature control.See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 6/12/2023Surface Analysis SoftwareThe Mountains® 10 surface metrology and microscopy analysis software from Digital Surf introduces new features and tools to enhance analysis capabilities. The MountainsImage® product...BioPhotonics May/Jun 2023 IssueFemtosecond LaserThe Chromacity 920 laser source is designed for two-photon microscopy and the excitation of key fluorophores and calcium markers. 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