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LED Substrates and Submounts

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Remtec Inc.
NORWOOD, Mass., Nov. 21, 2014 — Remtec has expanded its LED substrate and submount design capabilities with bond-pad down (flip-chip) packaging and selective gold-tin plating, among other features. The metallized LED substrates and submounts can be custom tailored to match required performance, power level or assembly needs. The devices use a variety of technologies on alumina, AIN and BeO ceramics, including PCTF with 20- to 75-µm copper, AgENIG and DBC with 125- to 250-µm copper. LED substrates for bond-pad down devices allow narrow gap capability for 50-µm-wide gaps suitable for InGaN, GaAs...See full product

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